Sponsors

Organizer

Co-Organizer

Committee

Honorary Chairs:

Prof. Toshio Fukuda, IEEE President 2020, Japan

Prof. Jun Zhang, President of Beijing Institute of Technology, China

Prof. Erke Mao, Academician of Chinese Academy of Engineering, China


General Chair:

Prof. Teng Long, Vice President of Beijing Institute of Technology, China

Technical Program Committee Chair:

Prof. Xiaopeng Yang, Beijing Institute of Technology, China

Technical Program Committee Co-Chairs:

Prof. Chenwei Deng, Beijing Institute of Technology, China

Prof. Zegang Ding, Beijing Institute of Technology, China


Award Committee Chair:

Prof. Cheng Hu, Beijing Institute of Technology, China


Publication Committee Chair:

Prof. Mengqi Zhou, Chinese Institute of Electronics, China


Technical Track Chairs:

Prof. Wei Chen, Tsinghua University, China

Prof. Jie Chen, Beihang University, China

Prof. Zengping Chen, Sun Yat-sen University, China

Prof. He Chen, Beijing Institute of Technology, China

Prof. Zesong Fei, Beijing Institute of Technology, China

Prof. Jian Guan, Naval Aeronautical University, China

Prof. Wen Hong, National Key Lab of Microwave Imaging Technology, CAS, China

Prof. Hua Huang, Beijing Institute of Technology, China

Prof. Shi Jin, Southeast University, China

Prof. Gang Li, Tsinghua University, China

Prof. Qiang Li, the 14th Research Institute of CETC, China

Prof. Xingdong Liang, National Key Lab of Microwave Imaging Technology, CAS, China

Dr. Tao Lin, UniStrong, China

Prof. Quanhua Liu, Beijing Institute of Technology, China

Prof. Chi Liu, Beijing Institute of Technology, China

Prof. Senlin Luo, Beijing Institute of Technology, China

Prof. Jinwen Ma, Peking University, China

Prof. Chuang Shi, Beihang University, China

Prof. Honggang Wang, University of Massacusetts Dartmouth, USA

Prof. Jingyuan Wang, Beihang University, China

Prof. Jie Wang, University of Science and Technology of China, China

Prof. Fan Wang, Peking University, China

Prof. Qihui Wu, Nanjing University of Aeronautics and Astronautics, China

Prof. Chengwen Xing, Beijing Institute of Technology, China

Prof. Jingwei Yin, Harbin Engineering University, China

Prof. Yin zhang, Zhongnan University of Economics and Law, China

Prof. Xiangdong Zhang, Beijing Institute of Technology, China

Prof. Weifeng Zhang, Beijing Institute of Technology, China


Technical Program Committee:

Prof. Bo Ai, Beijing Jiaotong University, China

Prof. Baigen Cai, Beijing Jiaotong University, China

Prof. Turgay Celik, University of Witwatersrand, South Africa

Prof. Longyong Chen, National Key Lab of Microwave Imaging Technology, CAS, China

Dr. Xinliang Chen, Beijing Institute of Technology, China

Prof. Fangjiong Chen, South China University of Technology, China

Prof. Xiaolong Chen, Naval Aviation University, China

Prof. Guolong Cui, University of Electronic Science and Technology of China, China

Prof. Fengzhou Dai, Xidian University, China

Prof. Chenwei Deng, Beijing Institute of Technology, China

Prof. Zhenmiao Deng, Sun Yat-sen University, China

Prof. Zegang Ding, Beijing Institute of Technology, China

Prof. Guiguang Ding, Tsinghua University, China

Dr. Xichao Dong, Beijing Institute of Technology, China

Prof. Lan Du, Xidian University, China

Prof. Li Du, Nanjing University, China

Prof. Xuan Feng, Jilin University, China

Prof. Jianghui Geng, Wuhan University, China

Prof. Yuantao Gu, Tsinghua University, China

Prof. Guan Gui, Nanjing University of Posts and Telecommunications, China

Dr. Zihuan Hao, Beijing Institute of Technology, China

Prof. Qian He, University of Electronic Science and Technology of China, China

Prof. Yuan He, Tsinghua University, China

Prof. Cheng Hu, Beijing Institute of Technology, China

Prof. Tian Jin, National University of Defense Technology, China

Prof. Julien Le Kernec, University of Glasgow, UK

Prof. Wei Li, Beijing Institute of Technology, China

Prof. Hongliang Li, University of Electronic Science and Technology of China, China

Prof. Hai Li, Civil Aviation University Of China, China

Prof. Yachao Li, Xidian University, China

Prof. Yingsong Li, Harbin Engineering University, China

Prof. Wangzhe Li, Institute of Electronics of the Chinese Academy of Sciences, China

Prof. Lianlin Li, Peking University, China

Prof. Feifeng Liu, Beijing Institute of Technology, China

Prof. Hai Liu, Guangzhou University, China

Prof. Yuxi Liu, Tsinghua University, China

Prof. Yimin Liu, Tsinghua University, China

Prof. Gui-Lu Long, Tsinghua University, China

Prof. Yidong Lou, Wuhan University, China

Prof. Yilong LU, Nanyang Technological University, Singapore

Prof. Xiaoji Niu, Wuhan University, China

Prof. Ferdinando Nunziata, Università degli Studi di Napoli Parthenope, Italy

Prof. Yuxin Peng, Peking University, China

Prof. Wei Peng, Huazhong University of Science and Technology, China

Prof. Yinghui Quan, Xidian University, China

Prof. Min Sheng, Xidian University, China

Prof. Longfei Shi, National University of Defense Technology, China

Prof. Bao-Sen Shi, University of Science and Technology of China, China

Dr. Yuze Sun, Tsinghua University, China

Prof. Jinhui Tang, Nanjing University of Science and Technology, China

Prof. Ran Tao, Beijing Institute of Technology, China

Prof. Xianpeng Wang, Hainan University, China

Dr. Yan Wang, Beijing Institute of Technology, China

Prof. Jianan Wang, Beijing Institute of Technology, China

Prof. Rui Wang, Beijing Institute of Technology, China

Prof. Yanhua Wang, Beijing Institute of Technology, China

Prof. Xuesong Wang, National University of Defense Technology, China

Prof. Yong Wang, Harbin Institute of Technology, China

Prof. Wenqin Wang, University of Electronic Science and Technology of China, China

Prof. Xilin Wang, Nanjing University, China

Prof. Shaoming Wei, Beihang University, China

Prof. Wenbin Shi, Beijing Institute of Technology, China

Prof. Nan Wu, Beijing Institute of Technology, China

Prof. Junjie Wu, University of Electronic Science and Technology of China, China

Prof. Yuntao Wu, Wuhan University of Technology, China

Prof. Zeyang Xia, Shenzhen Institutes of Advanced Technology,CAS, China

Dr. Yizhuang Xie, Beijing Institute of Technology, China

Prof. Xiongyao Xie, Tongji University, China

Prof. Xiulai Xu, Institute of Physics, Chinese Academy of Sciences, China

Prof. Zhenming Yu, Beijing University of Posts and Telecommunications, China

Prof. Ahmed I. Zayed, DePaul University-Chicago, USA

Prof. Tao Zeng, Beijing Institute of Technology, China

Prof. Haijun Zhang, University of Science & Technology Beijing, China

Prof. Zenghui Zhang, Shanghai Jiao Tong University, China

Prof. Fan Zhang, Beijing University of Chemical Technology, China

Prof. Bing Zhang, Aerospace Information Research Institute, CAS, China

Prof. Xiaoping Zhang, Ryerson University, Canada

Prof. Qinghua Zhang, Chongqing University of Posts and Telecommunications, China

Prof. Wei Zhang, Tsinghua University, China

Prof. Lijian Zhang, Nanjing University, China

Prof. Jun Zhang, the Hong Kong Polytechnic University, China

Prof. Yongchao Zhao, Institute of Electronics of CAS, China

Prof. Jibin Zheng, Xidian University, China

Prof. Yiming Zhu, University of Shanghai for Science and Technology, China

Prof. Shengqi Zhu, Xidian University, China

Prof. Weiping Zhu, Concordia University, Canada

Prof. Xihua Zou, Southwest Jiaotong University, China

Prof. Yulong Zou, Nanjing University of Posts and Telecommunications, China

International Advisory Committee:

Prof. James E. Fowler, Mississippi State University, USA

Prof. Gérard Lachapelle, University of Calgary, Canada

Prof. Shipeng Li, IFLYTEK CO., LTD., China

Prof. Jerome Zhengrong Liang, the State University of New York at Stony Brook, USA

Prof. Xuemin Lin, the University of New South Wales, Australia

Prof. Antonio Napolitano, University of Napoli Parthenope, Italy

Prof. Magdalena Salazar Palma, Charles the Third University of Madrid, Spain

Prof. Xiaojun Qiu, University of Technology Sydney, Australia

Prof. Caiming Qiu, Shanghai Jiao Tong University, China

Prof. Tapan K. Sarkar, Syracuse University, USA

Prof. Motoyuki Sato, Tohoku University, Japan

Prof. Yvon Savaria, Polytechnique Montreal, Canada

Prof. Qi Tian, University of Texas at San Antonio, USA

Prof. Ge Wang, Rensselaer Polytechnic Institute, USA

Prof. Wenwu Wang, University of Surrey, UK

Prof. Ke Wu, University of Montreal, Canada

Prof. Kai-Bor Yu, Shanghai Jiao Tong University, China

Prof. Yan Zhang, University of Oslo, Norway


Organizing Committee Co-chairs:

Prof. Wangzhe Li, National Key Lab of Microwave Imaging Technology, CAS, China

Dr. Jun Sun, the 14th Research Institute of CETC, China

Prof. Xiangfei Nie, Chongqing Three Gorges University, China

Prof. Quanhua Liu, Beijing Institute of Technology, China


Organizing Committee:

Mrs. Jingxin Fu, Beijing Institute of Technology, China

Miss Linlin Tian, Beijing Institute of Technology, China

Mrs. Chu Deng, Beijing Institute of Technology, China

Miss Feifei Han, Beijing Institute of Technology, China

Mrs. Fang Wei, Beijing Institute of Technology, China

Mr. Liyang Zhang, Beijing Institute of Technology, China

Important dates

Paper Submission Deadline:
30 April 2019
Extend to 31 May 2019
Paper Acceptance Notification:
15 July 2019
Camera-ready Paper Submission:
15 August 2019
Registration open date:
1 July 2019
Conference Date:
11-13 December, 2019

Remaining days till

IEEE ICSIDP 2019

Days

© Copyright 2018-2019 IEEE ICSIDP 2019